Tel: 86-21-64306513 | E-mail: sales@aoetech.com
Planarizing Coatings
PC3 Coatings | |
Coating PC3-700 PC3-1500 PC3-6000 |
Thickness 0.6µm - 1.6µm 1.1µm - 3.2µm 5.0µm - 12.2µm |
- Applications
- Planarizing Layer
- for use in etchback processes to transfer planar topology into an underlying dielectric
- Mechanical Protective Coating
- for use in protecting vital components during sawing and dicing operations
- Temporary Gluing Layer
- easily removable temporary adhesive layer for use in temporary bonding, back grinding or backside processing applications
- Planarizing Layer
- Properties
- Superb planarizing capability
- Compatible with resist coaters
- Impact on productivity
- Elimination of Chemical Mechanical Polishing (CMP) in some applicatios
- Suppression of microloading effects in etchback process
- Elimination of film peeling and cracking during dicing operations
- Easy removal in Resist Developer RD3 or RD6 after back grinding and wafer separation
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Tel: 86-21-64306513 E-mail: sales@aoetech.com