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MicroChem光刻胶-PMGI 负光刻胶

PMGI Lift-off Resists

 

Enable high yield, metal lift-off processing in a range of applications from data storage and wireless ICs to MEMS.

  • High thermal stability: Tg ∼190C
  • Enables sub 0.25µm bi-layer resist imaging
  • Single step development of bi-layer stack in TMAH or KOH developers

Ancillaries:

  • MCC Developers
  • Remover PG
  • MCC Thinner
  • EBR-PG

Applications

Cantilevers
Bi-layer Lift-off
T-gates
Microlenses
Airbridges

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